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Título: | Thermal stability of copper processed by multidirectional forging : effect of deformation amplitude and cumulative strain. |
Autor(es): | Flausino, Paula Cibely Alves Corrêa, Elaine Carballo Siqueira Pereira, Pedro Henrique Rodrigues Aguilar, Maria Teresa Paulino de Cetlin, Paulo Roberto |
Palavras-chave: | Copper Thermal stability Multidirectional Forging - MDF Severe Plastic Deformation - SPD Strain amplitude |
Data do documento: | 2022 |
Referência: | FLAUSINO, P. C. A. et al. Thermal stability of copper processed by multidirectional forging : effect of deformation amplitude and cumulative strain. Materials Science and Engineering A, v. 846, artigo 143299, maio 2022. Disponível em: <https://www.sciencedirect.com/science/article/pii/S0921509322006979>. Acesso em: 15 mar. 2023. |
Resumo: | Experiments were performed in order to evaluate the effect of deformation amplitude (Δε) and cumulative strain (ε) on the thermal stability of Copper 99.8% pure, after processing with 8 and 48 Multidirectional forging (MDF) cycles at room temperature with Δε ≈ 0.075 (MDF0.075) or 2 and 12 MDF cycles with Δε ≈ 0.30 (MDF0.30), leading to cumulative deformations of ε ≈ 1.8 and 10.8. The microstructural stability at elevated temperatures was evaluated through Differential Scanning Calorimetry (DSC) and heat treatments, combined with Vickers microhardness measurements and Electron Backscattered Diffraction (EBSD). Further analyses were carried out through thermodynamic considerations about the stored energy and driving pressures for boundary migration. The results showed that the thermal stability associated with static recrystallization decreases as ε and Δε in MDF increase, due to the presence of finer grain structures and higher dislocation density in the as-deformed material. In addition, the MDF-processed specimens deformed with high ε and Δε exhibited finer recrystallized grains than those processed with low ε and Δε as a result of their increased number of nucleation sites. Thermal stability increases in the following order: 12C-MDF0.30, 2C-MDF0.30, 48C-MDF0.075 and 8C-MDF0.075. |
URI: | http://www.repositorio.ufop.br/jspui/handle/123456789/16888 |
Link para o artigo: | https://www.sciencedirect.com/science/article/pii/S0921509322006979 |
DOI: | https://doi.org/10.1016/j.msea.2022.143299 |
ISSN: | 0921-5093 |
Aparece nas coleções: | DEMET - Artigos publicados em periódicos |
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ARTIGO_ThermalStabilityCopper.pdf Restricted Access | 14,35 MB | Adobe PDF | Visualizar/Abrir |
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