Please use this identifier to cite or link to this item:
Full metadata record
DC FieldValueLanguage
dc.contributor.authorBarros Filho, Roberto Monteiro de-
dc.contributor.authorMendes, Lourival Marin-
dc.contributor.authorNovack, Kátia Monteiro-
dc.contributor.authorAprelini, Leonardo Oliveira-
dc.contributor.authorBotaro, Vagner Roberto-
dc.identifier.citationBARROS FILHO, R. M. de et al. Hybrid chipboard panels based on sugarcane bagasse, urea formaldehyde and melamine formaldehyde resin. Industrial Crops and Products, v. 33, p. 369-373, 2011. Disponível em: <>. Acesso em: 02 fev. 2015.pt_BR
dc.description.abstractThe expansion of Brazilian agricultural production was very important in the last decade. A number of waste residues were produced showing an enormous potential for industrial crops and products. Sugarcane bagasse is the most important one and it has been investigated for chipboard panel’s preparation. In this sense, this work aims to develop, characterize and compare chipboard panels made with sugarcane bagasse with urea formaldehyde (UF) and melamine formaldehyde (MF) resins. Panels were obtained with a mixture of sugarcane bagasse and particles, like pine or eucalyptus, with and without paraffin in the formulation. Nine different types of panels have been made, all with 9% in resin mix, under a pressing cycle of 4.0MPacm2, and temperature of 160 ◦C. Under physical tests, the panels complied with the American Standard CS 236-66 for trading chipboards of medium density and, in most cases the results obtained were lower than the ones raised in the literature. Under mechanical tests, that same standard was not complied with and, in most cases the results were close to or higher than those obtained in the literature.pt_BR
dc.subjectChipboard panelspt_BR
dc.subjectMechanical testspt_BR
dc.subjectUrea formaldehydept_BR
dc.subjectMelamine formaldehydept_BR
dc.titleHybrid chipboard panels based on sugarcane bagasse, urea formaldehyde and melamine formaldehyde resin.pt_BR
dc.typeArtigo publicado em periodicopt_BR
dc.rights.licenseO periódico Industrial Crops and Products concede permissão para depósito deste artigo no Repositório Institucional da UFOP. Número da licença: 3581340545404.pt_BR
Appears in Collections:DEQUI - Artigos publicados em periódicos

Files in This Item:
File Description SizeFormat 
ARTIGO_HybridChipboardPanels.pdf441,73 kBAdobe PDFView/Open

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.